Flip-Chip packaging needs accurate trace position & surface smoothness on substrate. ICP provide the flip-chip packaging substrate made by thin film & lithography process which can meet various applications. Flip-Chip of LED on thin film ceramic heat-sink could increases the life & lighting efficiency apparently SPEC:
Flip-Chip packaging needs accurate trace position & surface smoothness on substrate. ICP provide the flip-chip packaging substrate made by thin film & lithography process which can meet various applications. Flip-Chip of LED on thin film ceramic heat-sink could increases the life & lighting efficiency apparently
SPEC: