Established in Jun 2009 and located in Taoyuan. ICP is dedicated to apply the thin film & lithography process on Alumina/Aluminium Nitride substrate to make passive and circuit components.

With both circuit design and processing capabilities, ICP can offer OEM/ODM manufacturing service for products with circuits on ceramic substrate.

With over 10 years of thin film components developing experience, The team members in ICP have already set up the 3rd generation OEM/ODM manufacturing service line. The line combines vacuum thin film deposition, lithography processing, electrodeposition and chemical deposition.

ICP can provide design and manufacturing services including, LED heat sink substrate , thin film passive/circuit protection integrated components, metallization of ceramic/silicon substrate, flip chip package substrate and thin/ thick film/ electro-deposition/ electroless-deposition integration processing.