About ICP

Team Accomplishment

  • The 1st team release high temperature Pt thin film sensor in Taiwan (1999)
  • The 1st team release current sensing resistor in Taiwan by lithography process(2000)
  • The 1st team release thin film high freq. chip inductor in size 0402 and 0603 in Taiwan (2002)
  • Complete series of thin film resistor in size 0201 ~ 2512 (2003)
  • The 1st team release thin film chip fuse (2004)
  • The 1st team release thin film ESD suppressor worldwide (2005)
  • 1st team release thick film printing NTC thermistor (2006)
  • The 1st team release thin film current sensing resistor in Taiwan (2007)

News:

 2010/09 [[News] ICP released a new design of LED devices with build-in protective components.------More

 2010/09 [Articles] ICP's LED devices exhibit small dimension and high thermal conductivity..-- More

 2010/09 [Articles] New LED generation - Solution of LED heat dissipation for high power LED applications.-----More

 2010/09 [[News] ICP released a patent of "Formation of tiny bores in LED heat-dissipated substrates".-----More

 2010/05 [Articles] Tendency of protection component.- -- More

 2010/04 [News] LEDinside -The new trend of dissipation-LED Heat Substrates-- --- More

 2010/03 [News] Capacity up to 100k pnl.

 2010/03 [Articles] 2010 New era of ceramic-LED dissipation solution------ More