2010/09 [[News] ICP released a new design of LED devices with build-in protective components.------More
2010/09 [Articles] ICP's LED devices exhibit small dimension and high thermal conductivity..-- More
2010/09 [Articles] New LED generation - Solution of LED heat dissipation for high power LED applications.-----More
2010/09 [[News] ICP released a patent of "Formation of tiny bores in LED heat-dissipated substrates".-----More
2010/05 [Articles] Tendency of protection component.- -- More
2010/04 [News] LEDinside -The new trend of dissipation-LED Heat Substrates-- --- More
2010/03 [News] Capacity up to 100k pnl.
2010/03 [Articles] 2010 New era of ceramic-LED dissipation solution------ More