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2024/01 |
[News] |
Exhibition 2024NEPCON. |
More |
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2023/10 |
[News] |
Exhibition 2023KES. |
More |
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2023/10 |
[News] |
Exhibition 2023Daegu International Future Auto & Mobility Expo. |
More |
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2010/09 |
[News] |
ICP released a new design of LED devices with build-in protective components. |
More |
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2010/09 |
[Articles] |
ICP's LED devices exhibit small dimension and high thermal conductivity. |
More |
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2010/09 |
[Articles] |
New LED generation - Solution of LED heat dissipation for high power LED applications. |
More |
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2010/09 |
[News] |
ICP released a patent of "Formation of tiny bores in LED heat-dissipated substrates".-- |
More |
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2010/05 |
[Articles] |
Tendency of protection component |
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2010/04 |
[News] |
LEDinside -The new trend of dissipation-LED Heat Substrates-- |
More |
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2010/03 |
[News] |
Capacity up to 100k pnl |
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2010/03 |
[Articles] |
2010 New era of ceramic-LED dissipation solution |
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2010/02 |
[News] |
ICP got the approval of ISO90001--- |
More |
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2009/12 |
[Products] |
ICP published thin-film AlN substrate |
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2009/11 |
[News] |
ICP opening ceremony |
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2009/06 |
[News] |
Establishment of ICP |
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